DipTrace PCB Layout • 'Extent' of PCB heat sink pattern in layout editor

I have created a pattern employing 1 square inch of the top layer of copper as a heat sink. (I know about using vias to transfer heat to the bottom layer, but that isn't pertinent to this discussion.) I adjusted the mask and paste settings to so that most of that area is covered. Everything looks good in the Pattern Editor.

I go to the component editor and link a transistor to the pattern. Everything's OK EXCEPT the pattern is skewed heavily to one side in the pattern window of the 'Attached Pattern' page of the Component Editor.

The problem occurs when I use the component in the PCB Layout Editor. When the pattern is selected, the 'corner markers' are well beyond the boundary of the pattern. So there is significant area, beyond the extent of the 1 sq inch of copper, that is 'claimed' by the heat sink. If I put another component in that area that falsely claimed by the heat sink, I cannot select it later as the heat sink is always selected.

My first thought was that I have some unnecessary bits of copper in the pattern area causing this, but this isn't the case.

Does anyone have any insight into why the pattern is claiming this large area?

Statistics: Posted by garytennyson — Today, 04:22 — Replies 1 — Views 114

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